Buffered memory module package and module-stacked package comprising the module package

It discloses with respect to a buffered memory module package including a buffer chip and multiple memory chips. Buffered memory module package in accordance with an embodiment of the present invention includes a buffer chip substrate, the buffer chip, a plurality of memory packages and the external connection terminal. Buffer chip board is provided with a buffer memory connection terminal and the connection terminal. Then, the buffer chip is mounted on the first area of ​​the buffer chip substrate so that the buffer connection terminal and electrically connected. And, a plurality of memory packages are mounted on a second area of ​​the buffer chip substrate to be electrically connected to the memory connecting terminal. Then, the external connection terminal is formed in a third region of the bottom of the buffer chip substrate. Also it discloses a buffered memory module, a stack package. Semiconductor package, memory modules, DIMM, the buffer chip