Pulse plating of matt tin: effect on properties
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[1] M. Bahrololoom,et al. Tribological properties of pulse plated nanocrystalline nickel coatings as environmentally accepted alternative to conventional chromium coatings , 2009 .
[2] I. Belov,et al. Influence of process parameters on crack formation in direct current and pulse reversal plated hard chromium , 2009 .
[3] V. García-Navas,et al. Influence of additives and plating parameters on morphology and mechanical properties of copper coatings obtained by pulse electrodeposition , 2009 .
[4] S. Roy,et al. Implementation of gold deposition by pulse currents for optoelectronic devices , 2009 .
[5] P. Berçot,et al. Basic analysis of transient curve on electroplating phenomena , 2008 .
[6] B. D. Barker,et al. Electrochemistry of tin deposition from mixed sulphate and methanesulphonate electrolyte , 2008 .
[7] S. Roy. Mass transfer considerations during pulse plating , 2008 .
[8] W. Hansal,et al. Influence of pulse plating parameters on morphology and hardness of pure tin deposit , 2008 .
[9] E. Taylor,et al. Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition , 2007 .
[10] J. Osenbach,et al. Sn-whiskers: truths and myths , 2006 .
[11] Z. Mekhalif,et al. Electrodeposition of Pb-free Sn alloys in pulsed current , 2006 .
[12] M. Suh,et al. Effects of plating parameters on alloy composition and microstructure of Sn–Bi electrodeposits from methane sulphonate bath , 2006 .
[13] Gery R. Stafford,et al. Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits , 2005 .
[14] M. Bestetti,et al. Electrochemical deposition and structural characterization of Au-Sn alloys , 2004 .
[15] Mark Pritzker,et al. Effect of pulse plating on composition of Sn–Pb coatings deposited in fluoroborate solutions , 2003 .
[16] Kwang-Lung Lin,et al. Electrodeposition of eutectic Sn–Zn alloy by pulse plating , 2003 .
[17] D. Landolt,et al. Microstructure and composition of pulse-plated metals and alloys , 2003 .
[18] P. Cavallotti,et al. Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings , 2002 .
[19] J. Abys,et al. A unique electroplating tin chemistry , 1999 .
[20] D. Landolt,et al. Variable length scale analysis of surface topography: characterization of titanium surfaces for biomedical applications , 1998 .
[21] Dong Nyung Lee,et al. Spontaneous growth mechanism of tin whiskers , 1998 .
[22] R. Winand. Electrocrystallization: theory and applications , 1992 .
[23] C. Wan,et al. A Study of the Current Efficiency Decrease Accompanying Short Pulse Time for Pulse Plating , 1989 .
[24] S. G. Meibuhr,et al. The Electrochemistry of Tin I . Effects of Nonionic Addition Agents on Electrodeposition from Stannous Sulfate Solutions , 1963 .
[25] W. Marsden. I and J , 2012 .
[26] K. Whitlaw,et al. A new fine‐grained matte pure tin for semiconductor lead‐frame applications , 2006 .
[27] Standard Test Methods for Determining Average Grain Size 1 , 2006 .
[28] M. Suh,et al. Effects of plating conditions on the microstructure of 80Sn20Pb electrodeposits from an organic sulphonate bath , 1996 .
[29] T. O’keefe,et al. Anodic pulse enhanced electrocrystallization (APEX) of tin , 1993 .
[30] G. B. Harris. X. Quantitative measurement of preferred orientation in rolled uranium bars , 1952 .