Experimental method and FE simulation model for evaluation of wafer probing parameters

Abstract Wafer probing technology is a critical testing technology that is used in the semiconductor manufacturing and packaging process. A well-designed probing system must enable low and stable contact resistance when each needle-like probe makes contact with the IC chip-bonding pad. Mechanical contact using excessive probe force causes over-sized scrub marks that may damage the die pad and sizably deform the probe tip. In this paper, an experimental setup of a single tungsten needle probe making contact with an Al pad was employed to investigate the relationships between the overdrive, contact force, and scrub mark length. A three-dimensional computational probing simulation model was developed for analyzing dynamic deformations of the contact phenomena during wafer testing. The mechanical tensile strength of the tungsten needle was tested with a micro-tester to examine the tensile stress–strain relationship. The elastoplastic behaviors of the probe and die were taken into account in the simulation model. The resultant scrub lengths from the simulation were verified against the experimental data. Additional critical data, such as data of the scrub mark sinking on the die surface and the maximum Von-Mises stress level location at the probe tips, can be predicted. The experimental and numerical methods presented here can be used as useful performance evaluation tools to support the choice of suitable probe geometry and wafer probe testing parameters.