Multilayer Antenna Package for IEEE 802.11ad Employing Ultralow-Cost FR4

This paper demonstrates the possibility and feasibility of an ultralow-cost antenna-in-package (AiP) solution for the upcoming generation of wireless local area networks (WLANs) denoted as IEEE802.11ad. The iterative design procedure focuses on maximally alleviating the inherent disadvantages of high-volume FR4 process at 60 GHz such as its relatively high material loss and fabrication restrictions. Within the planar antenna package, the antenna element, vertical transition, antenna feedline, and low- and high-speed interfaces are allocated in a vertical schematic. A circular stacked patch antenna renders the antenna package to exhibit 10-dB return loss bandwidth from 57-66 GHz. An embedded coplanar waveguide (CPW) topology is adopted for the antenna feedline and features less than 0.24 dB/mm in unit loss, which is extracted from measured parametric studies. The fabricated single antenna package is 9 mm × 6 mm × 0.404 mm in dimension. A multiple-element antenna package is fabricated, and its feasibility for future phase array applications is studied. Far-field radiation measurement using an inhouse radio-frequency (RF) probe station validates the single-antenna package to exhibit more than 4.1-dBi gain and 76% radiation efficiency.

[2]  Theodore S. Rappaport,et al.  On-Chip Integrated Antenna Structures in CMOS for 60 GHz WPAN Systems , 2009, GLOBECOM 2009 - 2009 IEEE Global Telecommunications Conference.

[3]  Farshid Aryanfar,et al.  Exploring Liquid Crystal Polymer (LCP) substrates for mm-Wave antennas in portable devices , 2010, 2010 IEEE Antennas and Propagation Society International Symposium.

[4]  Wonbin Hong,et al.  24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios , 2011, IEEE Antennas and Wireless Propagation Letters.

[5]  Duixian Liu,et al.  A Ball Grid Array Package With a Microstrip Grid Array Antenna for a Single-Chip 60-GHz Receiver , 2011, IEEE Transactions on Antennas and Propagation.

[6]  Robert W. Brodersen,et al.  A 60GHz Phased Array in CMOS , 2006, IEEE Custom Integrated Circuits Conference 2006.

[8]  Takashi Shimizu,et al.  Millimeter wave measurements of temperature dependence of complex permittivity of dielectric plates by a cavity resonance method , 1999, IMS 1999.

[9]  Theodore S. Rappaport,et al.  State of the Art in 60-GHz Integrated Circuits and Systems for Wireless Communications , 2011, Proceedings of the IEEE.

[10]  Paolo Arcioni,et al.  Millimeter-wave patch array antennas topologies on HTCC and HITCE substrates , 2011, 2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies.

[11]  Duixian Liu,et al.  An LTCC superstrate patch antenna for 60-GHz package applications , 2010, 2010 IEEE Antennas and Propagation Society International Symposium.

[12]  H.-R. Chuang,et al.  A 60-GHz millimeter-wave CMOS RFIC-on-chip meander-line planar inverted-F antenna for WPAN applications , 2008, 2008 IEEE Antennas and Propagation Society International Symposium.

[13]  L. Dussopt,et al.  60 GHz antennas in HTCC and glass technology , 2010, Proceedings of the Fourth European Conference on Antennas and Propagation.

[14]  Duixian Liu,et al.  Broadband Planar Superstrate Antenna for Integrated Millimeterwave Transceivers , 2006, IEEE Transactions on Antennas and Propagation.

[15]  L. L. Wai,et al.  Integration of slot antenna in LTCC package for 60 GHz radios , 2008 .

[16]  A. Natarajan,et al.  Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[17]  A. Lamminen,et al.  60-GHz Patch Antennas and Arrays on LTCC With Embedded-Cavity Substrates , 2008, IEEE Transactions on Antennas and Propagation.

[18]  Huey-Ru Chuang,et al.  A 60-GHz Millimeter-Wave CMOS Integrated On-Chip Antenna and Bandpass Filter , 2011, IEEE Transactions on Electron Devices.