An air-dielectric via structure for 20Gbps+ board connectors
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This paper introduces a novel air-dielectric via structure which can improve the interconnect signal bandwidth by reducing the impedance mismatch in vias of high speed system PCBs carrying 20 Gbps+ signals. Design methods of the proposed air-dielectric structure are presented. Using these methods a system target design impedance can be better matched thus causing reductions in the signal degradation caused by the reflections as well as propagation losses.
[1] G. G. Stokes. "J." , 1890, The New Yale Book of Quotations.
[2] John C. Laurx,et al. Interconnect Design Optimization and Characterization for Advanced High Speed Backplane Channel Links , 2009 .
[3] R. Bashirullah,et al. Air Cavity Transmission Lines for Off-Chip Interconnects Characterized to 40 GHz , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.