A method of thermal testing of microsystems

Abstract The paper presents a method of VLSI circuits testing using thermal phenomenon. The method is based on an original algorithm of placing temperature sensors on the chip surface and analysing temperature measurement results. The method enables both failure detection and location. Examples and results of analyses are presented.

[1]  P. Bratek,et al.  Temperature sensors placement strategy for fault diagnosis in integrated circuits , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[2]  Milton Ohring,et al.  Reliability and Failure of Electronic Materials and Devices, Second Edition , 1998 .

[3]  D. Griffin,et al.  Finite-Element Analysis , 1975 .

[4]  A. Napieralski,et al.  A new approach to thermal analysis of power devices , 1987, IEEE Transactions on Electron Devices.

[5]  Marta Rencz,et al.  CMOS temperature sensors and built-in test circuitry for thermal testing of ICs , 1998 .

[6]  Ozawa.  Analog methods for computer-aided circuit analysis & diagnosis , 1988 .

[7]  Melvin A. Breuer,et al.  Digital systems testing and testable design , 1990 .

[8]  Han-Taw Chen,et al.  Hybrid Laplace transform/finite-element method for two-dimensional transient heat conduction , 1988 .

[9]  Bernard Courtois,et al.  Design for thermal testability (DfTT) and a CMOS realization , 1996 .

[10]  E. A. Amerasekera,et al.  Failure Mechanisms in Semiconductor Devices , 1987 .

[11]  M. Rencz,et al.  Thermal monitoring through boundary-scan , 1998 .

[12]  A. E. Salama,et al.  Microprocessors functional testing techniques , 1989, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[13]  Márta Rencz,et al.  Thermal monitoring of safety-critical integrated systems , 1996, Proceedings of the Fifth Asian Test Symposium (ATS'96).

[14]  J. Cleaver,et al.  NEW HYBRID LAPLACE TRANSFORM/FINITE ELEMENT METHOD FOR TWO-DIMENSIONAL TRANSIENT HEAT CONDUCTION PROBLEM , 1991 .

[15]  Yervant Zorian,et al.  On-Line Testing for VLSI—A Compendium of Approaches , 1998, J. Electron. Test..

[16]  S. Kakaç,et al.  Cooling of Electronic Systems , 1994 .

[17]  M. Napieralska,et al.  Specific problems in smart power design , 1997, Proceedings of Second International Conference on Power Electronics and Drive Systems.

[18]  Bernard Courtois,et al.  Integrating on-chip temperature sensors into DfT schemes and BIST architectures , 1997, Proceedings. 15th IEEE VLSI Test Symposium (Cat. No.97TB100125).