A Non-Invasive Characterization Method for MEMS Based Devices

In the MEMS industry, it is imperative to characterize the fabricated die and test the functionality of its mechanical subcomponents. This paper presents a novel noninvasive characterization method for MEMS devices using aerodynamic forces. These forces are applied onto a desired part of a MEMS sensor to stimuli the moveable components and subsequently analyze its functions. In this approach, we use a micro-fabricated cantilever array chip as a case study of our proposed method. In this paper, we outline the proposed method and then demonstrate and discuss its multiphysics simulation results. The research results and discussions in this paper pave the way towards the development of a noninvasive rapid and low complexity air-based characterization system for MEMS devices.

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