A software tool for technology tradeoff evaluation in multichip packaging

A software tool for evaluating performance tradeoffs in multichip packaging is described. The tool enhances the manufacturability and decreases the design risk associated with the selection of packaging technologies for integrated circuits. Geometric, electrical, thermal, and manufacturing metrics can be estimated using the tool. The tool allows technologies to be changed and design rules to be modified using a what if approach. The role of technology tradeoff analysis in multichip system design and system compiler concepts are discussed, and implementation details of the present tool are described. A design example of a RISC processor module is presented, and the use of the tool for assessing mixed technology systems is demonstrated.<<ETX>>

[1]  H. B. Bakoglu,et al.  A system-level circuit model for multi- and single-chip CPUs , 1987, 1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.

[2]  L. L. Moresco Electronic system packaging: the search for manufacturing the optimum in a sea of constraints , 1989, Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,.

[3]  William E. Donath,et al.  Placement and average interconnection lengths of computer logic , 1979 .

[4]  C. Neugebauer,et al.  Comparison of Wafer Scale Integration with VLSI Packaging Approaches , 1987 .

[5]  William P. Birmingham,et al.  The MICON System for Computer Design , 1989, 26th ACM/IEEE Design Automation Conference.

[6]  J. Peter Krusius System interconnection of high-density multichip modules , 1991 .

[7]  Jerzy W. Rozenblit,et al.  Towards a VLSI packaging design support environment (PDSE); concepts and implementation , 1990, Proceedings., 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors.

[8]  Paul R. Calder,et al.  Composing user interfaces with InterViews , 1989, Computer.

[9]  Michael S. Adler GE high-density interconnect: a solution to the system interconnect problem , 1991 .