Thermomechanical response of bare and Al_2O_3-nanocoated Au/Si bilayer beams for microelectromechanical systems
暂无分享,去创建一个
Steven M. George | Martin L. Dunn | Ken Gall | Dudley Finch | K. Gall | M. Dunn | S. George | Brian A. Corff | D. Finch | M. Hulse | Michael Hulse
[1] J. Bravman,et al. Effect of Interface Conditions on Yield Behavior of Passivated Copper Thin Films , 2002 .
[2] C. Cabral,et al. Effect of a surface layer on the stress relaxation of thin films , 1996 .
[3] Chienliu Chang,et al. Innovative micromachined microwave switch with very low insertion loss , 2000 .
[4] M. D. Thouless,et al. Stress development and relaxation in copper films during thermal cycling , 1993 .
[5] G. Stoney. The Tension of Metallic Films Deposited by Electrolysis , 1909 .
[6] E. Arzt,et al. Stress–temperature behavior of unpassivated thin copper films , 1999 .
[7] Huajian Gao,et al. Constrained diffusional creep in UHV-produced copper thin films , 2001 .
[8] A. H. King,et al. The early stages of plastic yielding in polycrystalline gold thin films , 2001 .
[9] J. Bravman,et al. Anelastic contributions to the behavior of freestanding Al thin films , 1999 .
[10] A. Munkholm,et al. A search for strain gradients in gold thin films on substrates using x-ray diffraction , 2000 .
[11] Byung Man Kwak,et al. Snapping microswitches with adjustable acceleration threshold , 1996 .
[12] David M. Burns,et al. Optical power induced damage to microelectromechanical mirrors , 1998 .
[13] Subra Suresh,et al. Thermal cycling and stress relaxation response of Si-Al and Si-Al-SiO2 layered thin films , 1995 .
[14] Victor M. Bright,et al. Deformation and structural stability of layered plate microstructures subjected to thermal loading , 2002 .
[15] O. Kraft. Dislocations and deformation mechanisms in thin films and small structures : symposium held April 17-19, 2001, San Francisco, California, U.S.A. , 2001 .
[16] Victor M. Bright,et al. Micromachined, flip–chip assembled, actuatable contacts for use in high density interconnection in electronics packaging , 2001 .
[17] K. E. Harris,et al. Direct observation of diffusional creep via TEM in polycrystalline thin films of gold , 1998 .
[18] Steven M. George,et al. Surface Chemistry for Atomic Layer Growth , 1996 .
[19] William D. Nix,et al. Mechanical properties of thin films , 1989 .
[20] Hiroshi Oikawa,et al. Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon , 1998 .