Internal structure of metal material with gas permeability function related to MEMS devices

MEMS technology is incorporated into various devices (automobiles, digital cameras, optical devices) indispensable for our daily lives. Semiconductor manufacturing process technology such as photolithography method and ion beam method is mainly used for micropatterning necessary for MEMS and microfabrication of diffraction grating. In photolithography, many transfer defects caused by gas are generated. Therefore, a metal plate having gas permeability was prepared with a 3D printer, and the surface and internal structure of the metal plate was evaluated. Further, the porosity of the metal plate was calculated by measuring the size and weight of the produced metal plate. As a result, it was confirmed that there were numerous holes in the inside of the metallic material, and it was confirmed that the hole having the role of permeating the gas and the hole having the role of temporarily preserving the gas. Furthermore, it was also confirmed that the porosity of the metal plate is about 10%. Metallic materials with gas permeability can be expected to be materials required for MEMS device processing.

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