Arc plasma deposition of Pd seeding for Cu electroless deposition

[1]  S. Kim,et al.  Support Effect of Arc Plasma Deposited Pt Nanoparticles/TiO2 Substrate on Catalytic Activity of CO Oxidation , 2012 .

[2]  K. Barmak,et al.  Resistivity in rough metallic thin films: A Monte Carlo study , 2012 .

[3]  S. Endo,et al.  Behaviors of Metal Nano-Particles Prepared by Coaxial Vacuum Arc Deposition , 2010 .

[4]  R. Dryfe,et al.  Kinetics of electroless deposition: the copper-dimethylamine borane system. , 2010, Langmuir : the ACS journal of surfaces and colloids.

[5]  H. Chae,et al.  Argon and Nitrogen Plasma Surface Treatments of Polyimide Films for Electroless Copper Plating , 2009 .

[6]  M. Bouadi,et al.  Copper metallization of polymers by a palladium-free electroless process , 2006 .

[7]  Ho Won Choi,et al.  Enhancement of electron injection in inverted top-emitting organic light-emitting diodes using an insulating magnesium oxide buffer layer , 2005 .

[8]  T. Karabacak,et al.  Atomic layer deposition of Pd on TaN for Cu electroless plating , 2005 .

[9]  T. Hara,et al.  Resistivity of Thin Copper Interconnection Layers , 2005 .

[10]  D. Léonard,et al.  ELECTROLESS PLATING OF GLASS AND SILICON SUBSTRATES THROUGH SURFACE PRETREATMENTS INVOLVING PLASMA-POLYMERIZATION AND GRAFTING PROCESSES , 2004 .

[11]  K. Neoh,et al.  Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers , 2002 .

[12]  Chongmu Lee,et al.  Enhancement of Cu nucleation in Cu-MOCVD by Pd sputtering pretreatment , 2001 .

[13]  J. Duh,et al.  Improved characteristics of electroless Cu deposition on Pt–Ag metallized Al2O3 substrates in microelectronics packaging , 2001 .

[14]  R. Saraf,et al.  Laser assisted Pd seeding for electroless plating on SiO2 , 1994 .

[15]  Phillip J. Brock,et al.  Chemical vapor deposition of copper from 1,5‐cyclooctadiene copper(I) hexafluoroacetylacetonate , 1991 .

[16]  T. Hara,et al.  Electroplating of Copper Conductive Layer on the Electroless-Plating Copper Seed Layer , 2003 .