Arc plasma deposition of Pd seeding for Cu electroless deposition
暂无分享,去创建一个
S. Kim | J. Byun | W. Yoon | Juyeon Hwang
[1] S. Kim,et al. Support Effect of Arc Plasma Deposited Pt Nanoparticles/TiO2 Substrate on Catalytic Activity of CO Oxidation , 2012 .
[2] K. Barmak,et al. Resistivity in rough metallic thin films: A Monte Carlo study , 2012 .
[3] S. Endo,et al. Behaviors of Metal Nano-Particles Prepared by Coaxial Vacuum Arc Deposition , 2010 .
[4] R. Dryfe,et al. Kinetics of electroless deposition: the copper-dimethylamine borane system. , 2010, Langmuir : the ACS journal of surfaces and colloids.
[5] H. Chae,et al. Argon and Nitrogen Plasma Surface Treatments of Polyimide Films for Electroless Copper Plating , 2009 .
[6] M. Bouadi,et al. Copper metallization of polymers by a palladium-free electroless process , 2006 .
[7] Ho Won Choi,et al. Enhancement of electron injection in inverted top-emitting organic light-emitting diodes using an insulating magnesium oxide buffer layer , 2005 .
[8] T. Karabacak,et al. Atomic layer deposition of Pd on TaN for Cu electroless plating , 2005 .
[9] T. Hara,et al. Resistivity of Thin Copper Interconnection Layers , 2005 .
[10] D. Léonard,et al. ELECTROLESS PLATING OF GLASS AND SILICON SUBSTRATES THROUGH SURFACE PRETREATMENTS INVOLVING PLASMA-POLYMERIZATION AND GRAFTING PROCESSES , 2004 .
[11] K. Neoh,et al. Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers , 2002 .
[12] Chongmu Lee,et al. Enhancement of Cu nucleation in Cu-MOCVD by Pd sputtering pretreatment , 2001 .
[13] J. Duh,et al. Improved characteristics of electroless Cu deposition on Pt–Ag metallized Al2O3 substrates in microelectronics packaging , 2001 .
[14] R. Saraf,et al. Laser assisted Pd seeding for electroless plating on SiO2 , 1994 .
[15] Phillip J. Brock,et al. Chemical vapor deposition of copper from 1,5‐cyclooctadiene copper(I) hexafluoroacetylacetonate , 1991 .
[16] T. Hara,et al. Electroplating of Copper Conductive Layer on the Electroless-Plating Copper Seed Layer , 2003 .