论文信息 - Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills - 字舞流文

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

J. H. Lau | S. W. Ricky Lee | J. Lau | S. Lee

[1] R. Salganik,et al. The strength of adhesive joints using the theory of cracks , 1965 .

[2] Z. Suo,et al. Mixed mode cracking in layered materials , 1991 .

[3] J. H. Lau,et al. Effects of underfill delamination and chip size on the reliability of solder bumped Flip Chip on board , 1999 .

[4] James R. Rice,et al. Elastic Fracture Mechanics Concepts for Interfacial Cracks , 1988 .

[5] J. H. Lau,et al. Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants , 2000 .