Comprehensive dynamic analysis of wirebonding on Cu/low-K wafers

Comprehensive dynamic analysis is performed in this paper to simulate wirebonding on Cu/low-K wafers, which involves both the impact and the ultrasonic vibration stages. After the impact stage, the contact region between the pad and the gold ball is welded to allow subsequent ultrasonic vibrations to take place. Parametric studies are carried out to investigate structural responses of the Cu/low-K layer due to variation of the moduli of Cu/low-K components.

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