An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

AEROSPACE VEHICLES ARE MOSTLY EXPOSED TO RANDOM VIBRATION LOADS DURING ITS OPERATIONAL LIFETIME. THESE HARSH CONDITIONS EXCITES VIBRATION RESPONSES IN THE VEHICLES PRINTED CIRCUIT BOARDS, WHAT CAN CAUSE FAILURE ON MISSION FUNCTIONALITY DUE TO FATIGUE DAMAGE OF ELECTRONIC COMPONENTS. A NOVEL ANALYTICAL MODEL TO EVALUATE THE USEFUL LIFE OF EMBEDDED ELECTRONIC COMPONENTS (CAPACITORS, CHIPS, OSCILLATORS ETC.) MOUNTED ON PRINTED CIRCUIT BOARDS (PCB) IS PRESENTED. THE FATIGUE DAMAGE PREDICTIONS ARE CALCULATED BY THE RELATIVE DISPLACEMENT BETWEEN THE PCB AND THE COMPONENT, THE LEAD STIFFNESS, AS WELL THE NATURAL VIBRATION MODES OF THE PCB AND THE COMPONENT ITSELF. STATISTICAL METHODS ARE USED FOR FATIGUE CYCLE COUNTING. THE MODEL IS APPLIED TO EXPERIMENTAL FATIGUE TESTS OF PCBS AVAILABLE ON LITERATURE. THE ANALYTICAL RESULTS ARE OF THE SAME MAGNITUDE ORDER OF THE EXPERIMENTAL FINDINGS.

[1]  D. S. Steinberg,et al.  Vibration analysis for electronic equipment , 1973 .

[2]  Guglielmo S. Aglietti,et al.  Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review , 2009 .

[3]  Paulo José Paupitz Gonçalves,et al.  A model for computing vibration induced stresses of electronic components in a general flexible mounting , 2013 .

[4]  D. Followell,et al.  Vibration fatigue of surface mount technology (SMT) solder joints , 1995, Annual Reliability and Maintainability Symposium 1995 Proceedings.

[5]  Annett Wechsler,et al.  Formulas For Natural Frequency And Mode Shape , 2016 .

[6]  Da Yu,et al.  High-cycle fatigue life prediction for Pb-free BGA under random vibration loading , 2011, Microelectron. Reliab..

[7]  Dryver R. Huston,et al.  Active mass damping of electronic circuit boards , 2004 .

[8]  Arturo Cifuentes.  Estimating the dynamic behavior of printed circuit boards , 1994 .

[9]  Turan Dirlik,et al.  Application of computers in fatigue analysis , 1985 .

[10]  Guglielmo S. Aglietti,et al.  Accuracy of simplified printed circuit board finite element models , 2010, Microelectron. Reliab..

[11]  Fook Fah Yap,et al.  Reliability of PBGA assemblies under out-of-plane vibration excitations , 2002 .

[12]  T. E. Wong,et al.  Development of BGA solder joint vibration fatigue life prediction model , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[13]  Christian Lalanne.  Mechanical vibration & shock , 2002 .

[14]  Tom Stoumbos,et al.  Evaluating the Dynamic Behavior and Analytically Predicted Displacements of Printed Circuit Boards (PCBs) Using the “Smeared-Mass” & Fine Mesh Approach , 2015 .

[15]  Fook Fah Yap,et al.  Vibration reliability characterization of PBGA assemblies , 2000 .

[16]  C. Basaran,et al.  Measuring intrinsic elastic modulus of Pb/Sn solder alloys , 2002 .

[17]  D. J. Gorman,et al.  A comprehensive analytical solution for free vibration of rectangular plates with classical edge coditions: Experimental verification , 1992 .

[18]  Guglielmo S. Aglietti,et al.  Simplified modelling of printed circuit boards for spacecraft applications , 2006 .

[19]  Y. Bienvenu,et al.  Durability modelling of a BGA component under random vibration , 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

[20]  Alexander Veprik,et al.  Vibration Protection of Critical Components of Electronic Equipment in Harsh Environmental Conditions , 2003 .

[21]  Alexander Veprik,et al.  VIBRATION PROTECTION OF SENSITIVE ELECTRONIC EQUIPMENT FROM HARSH HARMONIC VIBRATION , 2000 .

[22]  Janko Slavič,et al.  Frequency-domain methods for a vibration-fatigue-life estimation – Application to real data , 2013 .

[23]  R A Amy,et al.  Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach , 2010, IEEE Transactions on Electronics Packaging Manufacturing.

[24]  Mei-Ling Wu.  Vibration-induced fatigue life estimation of ball grid array packaging , 2009 .