Creating 3D specific systems: Architecture, design and CAD

3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Finally critical areas that need better solutions are explored. These include design planning, test management, and thermal management.

[1]  H.P. Hofstee,et al.  Future microprocessors and off-chip SOP interconnect , 2004, IEEE Transactions on Advanced Packaging.

[2]  Paul D. Franzon,et al.  Design automation for a 3DIC FFT processor for synthetic aperture radar: A case study , 2009, 2009 46th ACM/IEEE Design Automation Conference.

[3]  Norman P. Jouppi,et al.  CACTI: an enhanced cache access and cycle time model , 1996, IEEE J. Solid State Circuits.

[4]  Kaustav Banerjee,et al.  3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration , 2001, Proc. IEEE.

[5]  Paul D. Franzon,et al.  Junction-level thermal extraction and simulation of 3DICs , 2009, 2009 IEEE International Conference on 3D System Integration.

[6]  Joungho Kim,et al.  Through silicon via (TSV) equalizer , 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.