Rapid prototyping of micromechanical devices using a Q-switched Nd:YAG laser with optional frequency doubling
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A laser technology for fabricating microelectromechanical components has been developed. Using a Q-switched Nd:YAG laser with optional frequency doubling, bulk silicon wafers and silicon membranes are micromachined without lithography-based technologies. The shape and depth of the cutting kerf is influenced by the position of the focal plane. Laser cutting of silicon reduces the breaking limit of the silicon structures. Using a cleaning process in HF and KOH, the breaking limit can be brought back to its original value. Gold thin films deposited on silicon have been structured by direct laser writing without damaging the substrate. Using silicon and thin-film laser machining, rapid prototyping and small lot production of microelectromechanical devices (MEMS) has been realized.
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