论文信息 - Analysis and modeling of critical current density effects on electromigration failure distributions of Cu dual-damascene vias

Analysis and modeling of critical current density effects on electromigration failure distributions of Cu dual-damascene vias

We investigate electromigration void morphologies, associated resistance increases and failure distributions for down-stream electron flow of Cu dual damascene via structures. We show that void formation occurs below the traditionally defined critical current density, and we develop a model to accurately predict via failure distributions as a function of current density.

A.S. Oates | M.H. Lin

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