Optimization of micro pin-fin heat sink with staggered arrangement

The effect of the pin-fin shapes on the overall performance of the carbon nanotube bundles as porous micro pin-fins with inline and staggered arrangement for the heat transfer and pressure drop is studied using FLUENT 15.0. The results of the study revealed that at 100 < Re < 2000, triangle has the best performance followed by square, rectangle, hexagon and circle in 1mm height, 15mm width and 45mm length silicon rectangular mini-channel. The staggered configuration gave better heat transfer performance than in-line arrangement at all Reynolds numbers for all shapes with up to 19% thermal improvement but with up to 79% pressure drop differential. On a mini-channel surface with nanotube fins, the nanofluid (0.001 to 1%) increases the thermal performance up to 40% in comparison with water. The best thermal performance enhancement of 106% was obtained by using staggered triangular fins with larger fin height of 0.75 mm, smaller fin width of 0.5 mm and spacing double the fin width and 0.01% CuO/H2O nanofluid followed by 103% with 0.01% Al2O3/H2O in comparison to channels with inline circular fins and water.

[1]  Kwan-Soo Lee,et al.  NUMERICAL SHAPE OPTIMIZATION FOR HIGH PERFORMANCE OF A HEAT SINK WITH PIN-FINS , 2004 .

[2]  Richard A. Wirtz,et al.  Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages , 1996 .

[3]  Hamid Reza Seyf,et al.  Computational analysis of nanofluid effects on convective heat transfer enhancement of micro-pin-fin heat sinks , 2012 .

[4]  A. Koşar,et al.  Forced convective heat transfer across a pin fin micro heat sink , 2005 .

[5]  J. Horng,et al.  Design Optimization for Pin-Fin Heat Sinks , 2005 .

[6]  Bobby Mathew,et al.  Characteristic Study on the Optimization of Pin-Fin Micro Heat Sink , 2009 .

[7]  N. Adam,et al.  Influence of geometrical parameters of hexagonal, circular, and rhombus microchannel heat sinks on the thermohydraulic characteristics☆ , 2014 .

[8]  P. W. Runstadler,et al.  Numerical and experimental evaluation of planar and staggered heat sinks , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

[9]  M. I. Hasan Investigation of flow and heat transfer characteristics in micro pin fin heat sink with nanofluid , 2014 .

[10]  R. Ricci,et al.  An experimental IR thermographic method for the evaluation of the heat transfer coefficient of liquid-cooled short pin fins arranged in line , 2006 .

[11]  Richard A. Wirtz,et al.  Thermal Performance of Pin-Fin Fan-Sink Assemblies , 1997 .

[12]  Ho Seon Ahn,et al.  A Review on Critical Heat Flux Enhancement With Nanofluids and Surface Modification , 2012 .

[13]  S. Balachandar,et al.  Heat transfer enhancement mechanisms in inline and staggered parallel-plate fin heat exchangers , 1997 .

[14]  Masud Behnia,et al.  A comparison of fin geometries for heatsinks in laminar forced convection: Part II -Optimization of staggered plate fin heatsink , 2001 .

[15]  Adrian Bejan,et al.  Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection , 1993 .

[16]  H. Hegab,et al.  Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks part I: Square and circle geometries , 2010 .

[17]  Bahram Moshfegh,et al.  Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

[18]  Richard A. Wirtz,et al.  Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks , 1994 .

[19]  Bahram Moshfegh,et al.  Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass , 2001 .

[20]  Z. Abdel-Rehim,et al.  Optimization and Thermal Performance Assessment of Pin-Fin Heat Sinks , 2008 .

[21]  Ephraim M Sparrow,et al.  Heat transfer from pin-fins situated in an oncoming longitudinal flow which turns to crossflow , 1982 .

[22]  A. Koşar,et al.  TCPT-2006-096.R2: Micro Scale pin fin Heat Sinks —Parametric Performance Evaluation Study , 2007, IEEE Transactions on Components and Packaging Technologies.

[23]  Ephraim M Sparrow,et al.  Performance comparisons among geometrically different pin-fin arrays situated in an oncoming longitudinal flow , 1982 .

[24]  Yildiz Bayazitoglu,et al.  Minichannels with carbon nanotube structured surfaces for cooling applications , 2011 .

[25]  Dong Liu,et al.  Experimental study on liquid flow and heat transfer in micro square pin fin heat sink , 2011 .

[26]  C. L. Chapman,et al.  Thermal performance of an elliptical pin fin heat sink , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[27]  P. Naphon,et al.  Heat transfer of nanofluids in the mini-rectangular fin heat sinks , 2013 .

[28]  Masaru Ishizuka,et al.  Cooling performance of plate fins for multichip modules , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

[29]  A. V. Barrett,et al.  Characterization of longitudinal fin heat sink thermal performance and flow bypass effects through CFD methods , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[30]  Zhaonian Cheng,et al.  A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array , 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.