Micro-Bump Assignment for Efficient Routing on Re-Distribution Layer (RDL) in 3D-ICs

RDL (Re-Distribution Layers) routing from the IO pads to micro-bumps plays an important role for transmitting signal between two adjacent layers in 3D IC. The quality of RDL-routing strongly depends on the positions of micro-bumps between two adjacent dies. Initially, I/O pads are assigned to micro-bumps and then single-layer routing is performed over the two RDLs that are adjacent to two respective layers. We propose an improved method for RDL-routing in 3D IC. Experimental results show that 100% routability can be achieved with reduced wire-length for all five test-cases that we have studied.

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