Distortion Minimization for Packaging Level Interconnects

We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line which states that if R/G = L/C, there will be no distortion at the receiver end and the signal propagates at the speed of light. The simulation results indicate that, using the shunt resistor scheme, 10+ Gbps bit rate is achievable over a 10 cm single-ended stripline without pre-emphasis or equalization

[1]  Masanori Hashimoto,et al.  Performance limitation of on-chip global interconnects for high-speed signaling , 2004, Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571).

[2]  M. Hashimoto,et al.  Performance prediction of on-chip high-throughput global signaling , 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

[3]  M. Hashimoto,et al.  On-chip global signaling by wave pipelining , 2004, Electrical Performance of Electronic Packaging - 2004.

[4]  Masanori Hashimoto,et al.  Design guideline for resistive termination of on-chip high-speed interconnects , 2005, Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005..

[5]  G. Ponchak,et al.  Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz , 2004, IEEE Transactions on Microwave Theory and Techniques.

[6]  Michael P. Flynn,et al.  Global signaling over lossy transmission lines , 2005, ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005..

[7]  Rui Shi,et al.  Surfliner: a distortionless electrical signaling scheme for speed of light on-chip communications , 2005, 2005 International Conference on Computer Design.

[8]  Howard W. Johnson,et al.  High Speed Signal Propagation: Advanced Black Magic , 2003 .

[9]  Eric D. Perfecto,et al.  Thin-film multichip module packages for high-end IBM servers , 1998, IBM J. Res. Dev..