Spray system for injecting coating or developing materials in semiconductor manufacturing process

The present invention The amount of the coating solution or the developing solution by applying to the spray nozzle, instead of how applied by using the centrifugal force three axis (x, y, z axis) adjustable by rotating the wafer, the coating liquid or a method of applying a developing solution to the semiconductor wafer to be significantly be reduced and as well as on the type spray injection system of a coating solution or a developing solution in a semiconductor manufacturing process to form a uniform coating film thickness, The wafer seating unit for mounting the wafer; A nozzle for applying a coating solution or a developing solution to the wafer mounted on the wafer mounting unit; A first guide unit for controlling the x-axis movement of the nozzle; A second guide unit for controlling the y-axis movement of the nozzle; Third guide unit for controlling the z-axis movement of the nozzle; A first centering unit and the second centering unit for aligning the center of the wafer mounted on the wafer mounting unit; It characterized in that it comprises; and removing the coating solution adhering to the edge portions of the wafer or pivoting arm unit which is used to wash the developing solution of the wafer. A semiconductor wafer, the guide unit, a stepping motor, a ball screw