Packaging of an optoelectronic-VLSI chip supporting a 32 X 32 array of surface-active devices

Innovative approaches to the packaging of a high-performance module accommodating a 32 X 32 array of surface-active devices indium bump bonded to a 9 X 9 mm2 VLSI chip are described. The module integrates a mini-lens array, a copper heat spreader, a thermoelectric cooler and an aluminum heatsink. The mini-lens array is aligned and packaged with the chip using a novel six degrees of freedom alignment technique. The module is compact (44 X 44 X 45 mm3), easy to assemble and can be passively removed and inserted into a free-space optical system with no need for further adjustments. The chip is mounted directly on a flexible printed-circuit board using a chip-on-board approach, providing 207 bond pad connections to the chip. The junction-to-TEC thermal resistance is only 0.4 degree(s)C/W.

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