Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

This paper presents a micro-mechanistic approach for modeling fatigue damage initi due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic cre modeled with void nucleation, void growth, and void coalescence model based on m structural stress fields. Micro-structural stress states are estimated under viscop phenomena like grain boundary sliding, its blocking at second-phase particles, and fusional creep relaxation. In Part II of this paper, the developed creep-fatigue dam model is quantified and parametric studies are provided to better illustrate the utilit the developed model. @DOI: 10.1115/1.1493202 #

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