Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology
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We present the development of an integrated Bluetooth transceiver module using a commercial low temperature co-fired ceramic (LTCC) process. The developed module contains a power amplifier (PA), low noise amplifier (LNA), mixer, balun, band select filter and integrated antenna. The MMICs and passives are developed using a commercial 0.24 /spl mu/m CMOS process and LTCC respectively. The power amplifier is capable of providing an output power of 20 dBm for the Bluetooth class 1 specification. To the best of our knowledge, this work presents the first report of module with integrated antennas.
[1] J.P.K. Gilb. Bluetooth radio architectures , 2000, 2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096).
[2] Joy Laskar,et al. Development of integrated three dimensional Bluetooth image reject filter , 2000, 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017).
[3] Deukhyoun Heo,et al. 0.24-um CMOS technology for Bluetooth power applications , 2000, RAWCON 2000. 2000 IEEE Radio and Wireless Conference (Cat. No.00EX404).