A polyjet 3D printed alternative for package to RFIC interconnects

Presented is a study of RFIC interconnect methodologies and a possible 3D printed alternative to traditional strategies. Using polyjet 3D printing technology, an easily reconfigurable wide bandwidth interconnect is constructed. Copper conductors are deposited on 3D printed structures, which make connection to an IC by means of conductive epoxy. Simulated and measured results for this structure are shown.

[1]  Amanpreet Kaur,et al.  Affordable 3D printed microwave antennas , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

[2]  T. P. Budka,et al.  Wide-bandwidth millimeter-wave bond-wire interconnects , 2001 .

[3]  Thomas Merkle,et al.  Polymer Multichip Module Process Using 3-D Printing Technologies for D-Band Applications , 2015, IEEE Transactions on Microwave Theory and Techniques.

[4]  J. Hoerber,et al.  Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures , 2015, 2015 European Microelectronics Packaging Conference (EMPC).

[5]  H. Kazemi,et al.  350mW G-band medium power amplifier fabricated through a new method of 3D-copper additive manufacturing , 2015, 2015 IEEE MTT-S International Microwave Symposium.

[6]  T. Krems,et al.  Millimeter-wave performance of chip interconnections using wire bonding and flip chip , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[7]  Manos M. Tentzeris,et al.  Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects , 2001 .

[8]  W. Heinrich,et al.  Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz , 2001 .

[9]  Saranraj Karuppuswami,et al.  Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[10]  Ben Wang,et al.  Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies , 2016, IEEE Transactions on Microwave Theory and Techniques.