High volume microprocessor test escapes, an analysis of defects our tests are missing

This paper explores defects found in a high volume microprocessor when shipping at a low defect level. A brief description of the manufacturing flow along with definition of DPM is covered. Three defective devices are then root cause analyzed for defect type, electrical effect and possible ways to screen earlier in the device life cycle or manufacturing process. The implications of these defects along with process trends are used to forecast the need for better tools and methods to earlier achieve high quality goals.