论文信息 - Corrections to "Enhancing the reliability of wafer level packaging by using solder joints layout design"

Corrections to "Enhancing the reliability of wafer level packaging by using solder joints layout design"

In the original paper (see ibid., vol.29, no.4, p.877-85, Dec. 2006) the photographs of authors Chang-Ming Liu and Chang-Chun Lee were inadvertently switched in the biography section. The correct placement is shown here.

Chang-Chun Lee | Kuo-Ning Chiang | Chang-Ming Liu

[1] Kuo-Ning Chiang,et al. Solder joints layout design and reliability enhancement of wafer level packaging , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

[2] Chang-Chun Lee,et al. Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design , 2006, IEEE Transactions on Components and Packaging Technologies.