Investigation of multi-layered-gate electrode workfunction engineered recessed channel (MLGEWE-RC) sub-50 nm MOSFET: A novel design

In this paper, a two-dimensional (2D) analytical sub-threshold model for a novel sub-50 nm multi-layered-gate electrode workfunction engineered recessed channel (MLGEWE-RC) MOSFET is presented and investigated using ATLAS device simulator to counteract the large gate leakage current and increased standby power consumption that arise due to continued scaling of SiO2-based gate dielectrics. The model includes the evaluation of surface potential, electric field along the channel, threshold voltage, drain-induced barrier lowering, sub-threshold drain current and sub-threshold swing. Results reveal that MLGEWE-RC MOSFET design exhibits significant enhancement in terms of improved hot carrier effect immunity, carrier transport efficiency and reduced short channel effects proving its efficacy for high-speed integration circuits and analog design. Copyright © 2008 John Wiley & Sons, Ltd.

[1]  T. Toyabe,et al.  Analytical models of threshold voltage and breakdown voltage of short-channel MOSFET's derived from two-dimensional analysis , 1979, IEEE Transactions on Electron Devices.

[2]  S. Asai,et al.  New grooved-gate MOSFET with drain separated from channel implanted region (DSC) , 1983, IEEE Transactions on Electron Devices.

[3]  张卫东,et al.  Fabrication and characterization of groove-gate MOSFETs based on a self-aligned CMOS process , 2006 .

[4]  J. Kavalieros,et al.  High-/spl kappa//metal-gate stack and its MOSFET characteristics , 2004, IEEE Electron Device Letters.

[5]  S. Y. Lee,et al.  Reliability for Recessed Channel Structure n-MOSFET , 2005, Microelectron. Reliab..

[6]  Kunihiro Suzuki Short channel epi-MOSFET model , 2000 .

[7]  Zhiping Yu,et al.  Design considerations of high-/spl kappa/ gate dielectrics for sub-0.1-/spl mu/m MOSFET's , 1999 .

[8]  Hyunsang Hwang,et al.  Electronic structures of high-k transition metal silicates: first-principles calculations , 2004, Microelectron. J..

[9]  F. Williams,et al.  Mechanism of thin-film electroluminescence , 1983, IEEE Transactions on Electron Devices.

[10]  Yeong-Seuk Kim,et al.  Silicon Complementary Metal–Oxide–Semiconductor Field-Effect Transistors with Dual Work Function Gate , 2006 .

[11]  Emmanuel Dubois,et al.  Short-channel effect immunity and current capability of sub-0.1-micron MOSFET's using a recessed channel , 1996 .

[12]  J.M.C. Stork,et al.  The impact of high-/spl kappa/ gate dielectrics and metal gate electrodes on sub-100 nm MOSFETs , 1999 .

[13]  X. Garros,et al.  75 nm damascene metal gate and high-k integration for advanced CMOS devices , 2002, Digest. International Electron Devices Meeting,.

[14]  K. Itoh,et al.  Simulation of sub-0.1- mu m MOSFETs with completely suppressed short-channel effect , 1993, IEEE Electron Device Letters.

[15]  Ganesh S. Samudra,et al.  Parasitic capacitance characteristics of deep submicrometre grooved gate MOSFETs , 2002 .

[16]  Seong-Geon Park,et al.  Improvement of NBTI and electrical characteristics by ozone pre-treatment and PBTI issues in HfAlO(N) high-k gate dielectrics , 2003, IEEE International Electron Devices Meeting 2003.

[17]  V. Misra,et al.  Compatibility of dual metal gate electrodes with high-k dielectrics for CMOS , 2003, IEEE International Electron Devices Meeting 2003.

[18]  Chenming Hu,et al.  Dual work function metal gate CMOS technology using metal interdiffusion , 2001, IEEE Electron Device Letters.

[19]  R. S. Gupta,et al.  Laterally amalgamated DUal Material GAte Concave (L-DUMGAC) MOSFET for ULSI , 2008 .

[20]  K. Chin,et al.  Dual material gate field effect transistor (DMGFET) , 1997, International Electron Devices Meeting. IEDM Technical Digest.

[21]  J. Liu,et al.  Dual-work-function metal gates by full silicidation of poly-Si with Co-Ni bi-Layers , 2005, IEEE Electron Device Letters.

[22]  P. Dobson Physics of Semiconductor Devices (2nd edn) , 1982 .

[23]  Xing Zhou,et al.  Exploring the novel characteristics of hetero-material gate field-effect transistors (HMGFETs) with gate-material engineering , 2000 .

[24]  Bing-Yue Tsui,et al.  A comprehensive study on the FIBL of nanoscale MOSFETs , 2004 .

[25]  Z.M. Rittersma,et al.  Characterization of mixed-signal properties of MOSFETs with high-k (SiON/HfSiON/TaN) gate stacks , 2006, IEEE Transactions on Electron Devices.

[26]  Manoj Saxena,et al.  Two-dimensional analytical sub-threshold model of multi-layered gate dielectric recessed channel (MLaG-RC) nanoscale MOSFET , 2008 .

[27]  Hongxia Ren,et al.  The influence of geometric structure on the hot-carrier-effect immunity for deep-sub-micron grooved gate PMOSFET , 2002 .

[28]  W. Lai,et al.  The Vertical Replacement-Gate (VRG) MOSFET: a 50-nm vertical MOSFET with lithography-independent gate length , 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).

[29]  Ken K. Chin,et al.  Dual-material gate (DMG) field effect transistor , 1999 .

[30]  Jinhong Yuan,et al.  Modeling short channel effect on high-k and stacked-gate MOSFETs , 2000 .

[31]  Chenming Hu Gate oxide scaling limits and projection , 1996, International Electron Devices Meeting. Technical Digest.

[32]  Suman Datta,et al.  High- /Metal-Gate Stack and Its MOSFET Characteristics , 2004 .

[33]  Toru Toyabe,et al.  Short-channel-effect-suppressed sub-0.1-/spl mu/m grooved-gate MOSFET's with W gate , 1995 .