论文信息 - On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers - 字舞流文

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

M. Schneider-Ramelow | S. Rzepka | Lukas Rauter | Johanna Zikulnig | A. Roshanghias | T. Braun | K. Becker | Christian Bretthauer | C. Scherf | M. Dreissigacker