Ultra-flexible microelectrode array nanostructured by FIB: A possible route to lower the device impedance

In this work we study the impedance behaviour of microelectrodes arrays nanostructured with different patterns by using a dual beam focused ion beam FIB. The devices were first fabricated by embedding a metal tri-layer of Ti/Au/Cr, 250nm thick, into two ultra-flexible polyimide layers, reaching a final thickness of 8@mm. Then, different patterns of holes (diameters from 100 to 500nm) were produced by milling single pixels at a current of ~10nA at increasing pitch (up to 3000nm) and at different dwell time (up to 12ms). The adopted milling parameters (in particular the single pixel milling strategy at rather high current) allow to obtain a nano-pattern onto an electrode area of 150x150@mm in a reasonably short time (from 10s to 5min for each electrode). Other patterns were also investigated in which the FIB was scanned uniformly to induce surface roughening. Electrochemical impedance spectroscopy analysis was performed in vitro in a KCl solution 100mM, by using a potentiostat VersaSTAT 4 by PAR, finding an average impedance reduction of about one order of magnitude respect to the impedance of the flat electrodes.