论文信息 - “glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.

H. Schroder | L. Brusberg | N. Arndt-Staufenbiel

[1] S. Iraj Najafi,et al. Introduction to glass integrated optics , 1992 .

[2] Fred Barlow,et al. Thin Film Technology Handbook , 1997 .

[3] Norbert Arndt-Staufenbiel,et al. Specific glass fiber technologies: lensing and laser fusion , 2004, Other Conferences.

[4] H. Schroder,et al. Planar glass waveguides for ffigh performance electrical-optical-circuit-boards (EOCB) - the glass-layer-concept , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[5] E. Griese,et al. Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides , 2008, 2008 58th Electronic Components and Technology Conference.

[6] E. Griese,et al. Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards , 2006, SPIE OPTO.

[7] H. Schroder,et al. Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach , 2006, IEEE Transactions on Advanced Packaging.

[8] Keming Du,et al. Subsurface precision machining of glass substrates by innovative lasers , 2003 .