论文信息 - Fabrication of patterned gold microstructure by selective electroless plating

Fabrication of patterned gold microstructure by selective electroless plating

Patterned gold microstructures on glass or Si wafers have been fabricated by a novel method which is composed of selective electroless plating and microcontact printing. This process may be widely used for the production of fine metal patterns in printed circuits or as a substrate to form patterned SAMs. In addition, these patterned metal microstructures can be readily transferred to adhesive tape surface to fabricate flexible metal microstructure, which may be applied in all-plastic circuit.

[1] W. Dressick,et al. Photopatterning and selective electroless metallization of surface-attached ligands , 1993 .

[2] G. Whitesides,et al. Microcontact Printing of Palladium Colloids: Micron-Scale Patterning by Electroless Deposition of Copper , 1996 .

[3] Michael J. Natan,et al. Hydroxylamine Seeding of Colloidal Au Nanoparticles in Solution and on Surfaces , 1998 .

[4] G. Cheng,et al. Controlled nucleation and growth of surface-confined gold nanoparticles on a (3-aminopropyl)trimethoxysilane-modified glass slide: a strategy for SPR substrates. , 2001, Analytical chemistry.

[5] J. Calvert,et al. Selective copper chemical vapor deposition using Pd-activated organosilane films , 1995 .

[6] P. Stroeve,et al. Electroless Gold as a Substrate for Self-Assembled Monolayers , 1998 .

[7] R. M. Cohen,et al. Measurement of excess charge at polarized electrodes with field effect transistors , 1983 .

[8] M. S. Chen,et al. Adhesive Electroless Metallization of Fluoropolymeric Substrates , 1993, Science.

[9] H. Menzel,et al. Surface‐Confined Nanoparticles as Substrates for Photopolymerizable Self‐Assembled Monolayers , 1999 .

[10] George M. Whitesides,et al. Patterned self-assembled monolayers formed by microcontact printing direct selective metalization by chemical vapor deposition on planar and nonplanar substrates , 1995 .