Development of a high speed and precision wire clamp with both position and force regulations

This paper presents the mechanism and robust control of a monolithic wire clamp to achieve fast and precision operations for strong and robust micro device packaging. The wire clamp is piezoelectrically actuated and a two-stage flexure-based amplification was designed to obtain large and parallel jaw displacements. The grasping forces of the wire clamp were evaluated based on finite element analysis (FEA), and the force measurement was presented. The wire clamp was manufactured using wire EDM technique and the position and force transfer functions were obtained based on the frequency response approach. The position/force switching control strategy was employed to regulate the motion position and grasping force, and the position/force switching controller composed of a PID controller for position control and a sliding model controller (SMC) for force control was designed. Experimental tests were carried out to investigate the performance of wire clamp with the position/force switching controller during the grasping and releasing operations. The results show that the wire clamp exhibits good performance and demonstrate that high speed and precision grasping operations can be realized through the developed wire clamp and the control strategy. A novel monolithic wire clamp mechanism with a two-stage amplification was presented.The wire clamp has a large amplification factor and parallel jaw motion can be realized.Both the position and force of the wire clamp were regulated.Fast and precision grasping and releasing operations have been realized through the wire clamp.

[1]  Kiyoshi Ohishi,et al.  Novel force-sensor-less contact motion control for quick and smooth industrial robot motion , 2011, IECON 2011 - 37th Annual Conference of the IEEE Industrial Electronics Society.

[2]  Y. Zhou,et al.  Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding , 2011, Microelectron. Reliab..

[3]  Chidentree Treesatayapun,et al.  Grasping force controller for parallel grip with fuzzy rules emulated networks , 2013 .

[4]  Byungkyu Kim,et al.  Identification and control of a sensorized microgripper for micromanipulation , 2005, IEEE/ASME Transactions on Mechatronics.

[5]  Qingsong Xu Precision Position/Force Interaction Control of a Piezoelectric Multimorph Microgripper for Microassembly , 2013, IEEE Transactions on Automation Science and Engineering.

[6]  David M. Dozor Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments , 1998, Smart Structures.

[7]  Yanling Tian,et al.  A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging. , 2015, The Review of scientific instruments.

[8]  Wei Zheng,et al.  Elman Fuzzy Adaptive Control for Obstacle Avoidance of Mobile Robots Using Hybrid Force/Position Incorporation , 2012, IEEE Transactions on Systems, Man, and Cybernetics, Part C (Applications and Reviews).

[9]  Z. W. Zhong,et al.  Overview of wire bonding using copper wire or insulated wire , 2011, Microelectron. Reliab..

[10]  Qingsong Xu,et al.  Design and Robust Repetitive Control of a New Parallel-Kinematic XY Piezostage for Micro/Nanomanipulation , 2012, IEEE/ASME Transactions on Mechatronics.

[11]  Fuliang Wang,et al.  Finite element analysis of wire clamp for wire bonding , 2012 .

[12]  X Zhao,et al.  Robust and precision control for a directly-driven XY table , 2011 .

[13]  Qingsong Xu,et al.  Adaptive Sliding Mode Control With Perturbation Estimation and PID Sliding Surface for Motion Tracking of a Piezo-Driven Micromanipulator , 2010, IEEE Transactions on Control Systems Technology.

[14]  Yanling Tian,et al.  Electrical matching of low power piezoelectric ultrasonic transducers for microelectronic bonding , 2013 .

[15]  Alberto Borboni,et al.  PKM Mechatronic Clamping Adaptive Device , 2015 .

[16]  Yanling Tian,et al.  Dynamic modeling and control of a novel XY positioning stage for semiconductor packaging , 2015 .

[17]  Qingsong Xu,et al.  A Novel Piezoactuated XY Stage With Parallel, Decoupled, and Stacked Flexure Structure for Micro-/Nanopositioning , 2011, IEEE Transactions on Industrial Electronics.

[18]  Di Wu,et al.  Using Fuzzy Switching to Achieve the Smooth Switching of Force and Position , 2013 .

[19]  Fuliang Wang,et al.  Modeling and Experimental Study of a Wire Clamp for Wire Bonding , 2015 .

[20]  Q. Yang,et al.  A Monolithic Compliant Piezoelectric-Driven Microgripper: Design, Modeling, and Testing , 2013, IEEE/ASME Transactions on Mechatronics.

[21]  Qingsong Xu,et al.  Model Reference Adaptive Control With Perturbation Estimation for a Micropositioning System , 2014, IEEE Transactions on Control Systems Technology.

[22]  Micky Rakotondrabe,et al.  Development and Force/Position Control of a New Hybrid Thermo-Piezoelectric MicroGripper Dedicated to Micromanipulation Tasks , 2011, IEEE Transactions on Automation Science and Engineering.

[23]  Massimo Callegari,et al.  Study of a Fully Compliant U-Joint Designed for Minirobotics Applications , 2012 .

[24]  Bijan Shirinzadeh,et al.  Development of a novel flexure-based microgripper for high precision micro-object manipulation , 2009 .

[25]  Yanling Tian,et al.  An Improved Adaptive Genetic Algorithm for Image Segmentation and Vision Alignment Used in Microelectronic Bonding , 2014, IEEE/ASME Transactions on Mechatronics.

[26]  X Zhao,et al.  Design and control of a directly-driven bond head for thermosonic bonding , 2010 .

[27]  Qingsong Xu New robust position and force regulation for a compliant microgripper , 2013, 2013 IEEE International Conference on Automation Science and Engineering (CASE).

[28]  Ping Li,et al.  Experimental study on the package of high-g accelerometer , 2012 .

[29]  Qingsong Xu,et al.  Design and Smooth Position/Force Switching Control of a Miniature Gripper for Automated Microhandling , 2014, IEEE Transactions on Industrial Informatics.

[30]  Chao-Ton Su,et al.  Optimization of the Cu wire bonding process for IC assembly using Taguchi methods , 2011, Microelectron. Reliab..

[31]  Nicolae Lobontiu In-Plane Compliances of Planar Flexure Hinges With Serially Connected Straight- and Circular-Axis Segments , 2014 .