Fabrication of Ultra Deep Electrical Isolation Trenches with High Aspect Ratio Using DRIE and Dielectric Refill

A novel technique to fabricate ultra deep high aspect ratio electrical isolation trenches with DRIE and dielectric refill is presented. The relationship between trench profile and DRIE parameters is discussed. By optimizing DRIE parameters and RIE etching the trenches’opening ,the ideal trench profile is obtained to ensure that the trenches are fully refilled without voids. The electrical isolation trenches are 5μm wide and 92μm deep with 015μm thick oxide layers on the sidewall as isolation material. The measured I2V result shows that the trench structure has good electrical isolation performance :the average resistance in the range of 0~100V is more than 10Ω and no breakdown appears under 100V. This isolation trench structure has been used in fabrication of the bulk integrated micromachined gyroscope ,which shows high performance.