Manufacturing method of back light with printed circuit of film type and back light unit device thereof

A manufacturing method of a BLU of a printed circuit attaching method of the present invention comprises; a step of removing a release paper of a polyimide (PI) film; a step of coating an adhesive to a printed circuit film by adding heat and pressure; a step of printing an electric circuit pattern on the printed circuit film surface in which the adhesive is coated using paste including a conductive material; a step of soaking the film in which the conductive paste is printed in a Cu electrolyte and plating it through electrolytic analysis; a step of printing PSR paste on the printed circuit film surface in which the Cu is plated; a step of printing a cream solder on a PI film surface soldering unit; a step of mounting an LED on a cream solder printing unit automatically; a step of soldering an LED chip by adding a heat to the cream solder after the LED is mounted; a step of attaching the adhesive to a heat radiation base; a step of cutting the printed circuit film and separating it into a unit printed circuit film; a step of fitting the unit printed circuit film up by adding a heat to the adhesive; and a step of maximizing adhesive force using air pressure and heat and removing bubbles.