Sub-Half Micrometer Resist Processes For The Aeble-150

Recent results in the development of positive and negative resist processes for use with the AEBLE-150 electron beam lithography system are discussed, detailing techniques used for the evaluation and modeling of resist performance. Specific results for RD-2000N, a negative resist available commercially from the Hitachi Corporation, are presented demonstrating processes suitable for use with the AEBLE-150 for feature sizes below 0.5μm. In addition, results of processes with high resolution imaging in thick layers of PMMA are presented.