Finite Element Analysis of MEMS Package under High Impact

Under high-g(104g or above,g is the acceleration of gravity) impact load conditions,onboard micro electro-mechanical system(MEMS)(such as gyroscopes or accelerometer) and electronics package and interconnection are critical concern that influence the reliability of total projectile.A research on this problem is conducted to reveal the influencing factors and assess package reliability using finite element modeling and simulation method.A finite element modeling(FEM) dynamic analysis is conducted on a typical leadless chip carrier(LCC) package.In order to be closer to the engineering practice,the bilinear kinematic hardening model is chosen for the solder joints.Several sensitive factors that influence the reliability of solder joint are analyzed in detail,and several suggestions are given to improve the reliability of MEMS package.