Nanomaterials for Microelectronic and Bio-packaging

This chapter addresses the state-of-art nanoscience and technologies related to the next generation high-density microelectronics and bio-packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, lead-free nanoalloys for lead-free interconnection, nano-conductive adhesives, molecular wires for electrical interconnects, low-stress and high thermal conductive flip-chip underfills, high-k dielectric for embedded passives, bio-mimic Lotus effect with both nano-micro surfaces for self-cleaning and molecular dynamic (MD) simulations for nanomaterial study and prediction, etc.

[1]  W. Barthlott,et al.  Purity of the sacred lotus, or escape from contamination in biological surfaces , 1997, Planta.

[2]  T. Wisleder,et al.  Size-dependent melting point depression of nanostructures: Nanocalorimetric measurements , 2000 .

[3]  Wangyu Hu,et al.  Melting evolution and diffusion behavior of vanadium nanoparticles , 2005 .

[4]  Xiuling Li,et al.  In-plane control of morphology and tunable photoluminescence in porous silicon produced by metal-assisted electroless chemical etching , 2002 .

[5]  Michael I. Baskes,et al.  Determination of modified embedded atom method parameters for nickel , 1997 .

[6]  S. Alavi,et al.  Molecular dynamics simulations of the melting of aluminum nanoparticles. , 2006, The journal of physical chemistry. A.

[7]  Xiaoning Yang,et al.  Molecular Dynamics Simulation of the Melting Behavior of Pt−Au Nanoparticles with Core−Shell Structure , 2008 .

[8]  P. Vianco,et al.  Evaluation of Lead- Free Solder Joints in Electronic Assemblies , 1994 .

[9]  C. Wong,et al.  Tailored Dielectric Properties of High-k Polymer Composites via Nanoparticle Surface Modification for Embedded Passives Applications , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[10]  Q. Jiang,et al.  Comparison of different models for melting point change of metallic nanocrystals , 2001 .

[11]  Schafer,et al.  Melting of isolated tin nanoparticles , 2000, Physical review letters.

[12]  Yi Li,et al.  Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications , 2006 .

[13]  Yi Li,et al.  Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives , 2005 .

[14]  K. Moon,et al.  Silver/polymer nanocomposite as a high-kpolymer matrix for dielectric composites with improved dielectric performance , 2008 .

[15]  K. Moon,et al.  Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications , 2005 .

[16]  Bharat Bhushan,et al.  Micro- and nanoscale characterization of hydrophobic and hydrophilic leaf surfaces , 2006 .

[17]  Ching-Ping Wong,et al.  Low temperature carbon nanotube film transfer via conductive polymer composites , 2007 .

[18]  M. Baskes,et al.  Modified embedded-atom potentials for cubic materials and impurities. , 1992, Physical review. B, Condensed matter.

[19]  C. Koch,et al.  The melting point depression of tin in mechanically milled tin and germanium powder mixtures , 1989 .

[20]  Lydéric Bocquet,et al.  Low-friction flows of liquid at nanopatterned interfaces , 2003, Nature materials.

[21]  M. Baskes,et al.  Molecular dynamics studies of thin-films of Sn on Cu , 1997 .

[22]  Yi Li,et al.  Electronics Without Lead , 2005, Science.

[23]  J. G. Lee,et al.  Solid/liquid two-phase structures in isolated nanometer-sized alloy particles , 2004 .

[24]  M. Green,et al.  Light trapping properties of pyramidally textured surfaces , 1987 .

[25]  Lingbo Zhu,et al.  Well-aligned open-ended carbon nanotube architectures: an approach for device assembly. , 2006, Nano letters.

[26]  Nguyen,et al.  Grain-boundary melting transition in an atomistic simulation model. , 1986, Physical review letters.

[27]  W. Barthlott,et al.  Movement and regeneration of epicuticular waxes through plant cuticles , 2001, Planta.

[28]  Jin Yu,et al.  Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique , 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

[29]  H. Ye,et al.  Three distinctive melting mechanisms in isolated nanoparticles , 2001 .

[30]  K. Moon,et al.  Self-assembled monolayer-assisted chemical transfer of in situ functionalized carbon nanotubes. , 2008, Journal of the American Chemical Society.

[31]  Frank G. Shi,et al.  Size dependent thermal vibrations and melting in nanocrystals , 1994 .

[32]  Martin Stutzmann,et al.  Black nonreflecting silicon surfaces for solar cells , 2006 .

[33]  Lai,et al.  Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric Measurements. , 1996, Physical review letters.

[34]  Wolf,et al.  Molecular-dynamics study of lattice-defect-nucleated melting in silicon. , 1989, Physical review. B, Condensed matter.

[35]  Karl -Joseph Hanszen,et al.  Theoretische Untersuchungen über den Schmelzpunkt kleiner Kügelchen , 1960 .

[36]  H. Ye,et al.  A cluster-induced structural disorder and melting transition in the grain boundary of B2 NiAl: a molecular-dynamics simulation on parallel computers , 2000 .

[37]  K. Moon,et al.  The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production , 2007 .

[38]  K. Moon,et al.  Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate , 2004 .

[39]  Yi Li,et al.  High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications , 2007 .

[40]  Bongtae Han,et al.  Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry , 1995 .

[41]  Yutaka Tsukada,et al.  Surface laminar circuit packaging , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[42]  Wilhelm Barthlott,et al.  Characterization and Distribution of Water-repellent, Self-cleaning Plant Surfaces , 1997 .

[43]  Y. Xiu,et al.  Superhydrophobic and low light reflectivity silicon surfaces fabricated by hierarchical etching. , 2008, Langmuir : the ACS journal of surfaces and colloids.

[44]  Richard Ulrich,et al.  Integrated passive component technology , 2003 .

[45]  Ching-Ping Wong,et al.  Aligned carbon nanotube stacks by water-assisted selective etching. , 2005, Nano letters.

[46]  Ching-Ping Wong,et al.  Synthesis and dielectric properties of novel high-K polymer composites containing in-situ formed silver nanoparticles for embedded capacitor applications , 2006 .

[47]  Lei Jiang,et al.  One‐Step Solution‐Immersion Process for the Fabrication of Stable Bionic Superhydrophobic Surfaces , 2006 .

[48]  K. Mitsuishi,et al.  Particle-size dependence of phase stability and amorphouslike phase formation in nanometer-sized Au-Sn alloy particles , 2001 .

[49]  Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications , 2005 .