论文信息 - Analysis of Plasma-Induced Modification of ULK and eULK Materials: Dual Damascene Processing Challenges for 45nm (K ⩽ 2.4) and Beyond BEOL Technologies - 字舞流文

Analysis of Plasma-Induced Modification of ULK and eULK Materials: Dual Damascene Processing Challenges for 45nm (K ⩽ 2.4) and Beyond BEOL Technologies

S. Bent | S. Nitta | S. Purushothaman | N. Fuller | M. Worsley | T. Magbitang | G. Dubois | M. Sankar | T. Dalton | T. Tai | R. Miller | W. Volksen