A programmable thermal management interface circuit for PowerPC systems

A programmable thermal management interface circuit for PowerPC systems has been designed, implemented, and tested for the Integrated Thermal Management (ITEM) System [1]. Instead of worst-case design, the ITEM system approach is to target nominal power dissipation and have the system actively monitor its thermal activity and control cooling mechanisms to ensure operation within specification. Using a suitable combination of hardware and software, the interface design yields intricate control and optimal management with little system overhead and minimum hardware requirements, as well as provides the flexibility to support different management algorithms. This interface circuit was fabricated in the HP 0.5 μm single-poly 3-metal process through MOSIS.

[1]  John Choma,et al.  Feed-forward gain compensation for CMOS continuous-time /spl Sigma//spl Delta/ modulators , 1999, ICECS'99. Proceedings of ICECS '99. 6th IEEE International Conference on Electronics, Circuits and Systems (Cat. No.99EX357).

[2]  Herming Chiueh,et al.  A high-speed digital comb filter for /spl Sigma//spl Delta/ analog-to-digital conversion , 1999, 42nd Midwest Symposium on Circuits and Systems (Cat. No.99CH36356).

[3]  Herming Chiueh,et al.  A high–speed CMOS on–chip temperature sensor , 1999 .

[4]  Mark Horowitz,et al.  IRSIM: An Incremental MOS Switch-Level Simulator , 1989, 26th ACM/IEEE Design Automation Conference.

[5]  John Choma,et al.  Implementation of a Temperature Monitoring Interface Circuit for PowerPC systems , 2000, Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144).

[6]  Herming Chiueh,et al.  A novel fully integrated fan controller for advanced computer systems , 2000, 2000 Southwest Symposium on Mixed-Signal Design (Cat. No.00EX390).

[7]  J. Steele.  ACPI thermal sensing and control in the PC , 1998, Wescon/98. Conference Proceedings (Cat. No.98CH36265).

[8]  Jeffrey T. Draper,et al.  Thermal Management in Embedded Systems Using MEMS , 1998, IPPS/SPDP Workshops.

[9]  Jeffrey T. Draper,et al.  A bus-efficient low-latency network interface for the PDSS multicomputer , 1997, Proceedings. The Sixth IEEE International Symposium on High Performance Distributed Computing (Cat. No.97TB100183).

[10]  Herming Chiueh,et al.  A THERMAL EVALUATION OF INTEGRATED CIRCUITS : ON CHIP OFFSET TEMPERATURE MEASUREMENT AND MODELING , 1998 .

[11]  M. Rencz,et al.  Thermal testing methods to increase system reliability , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[12]  Robert W. Brodersen.  Anatomy of a Silicon Compiler , 1992 .

[13]  John Choma,et al.  A novel model for on-chip heat dissipation , 1998, IEEE. APCCAS 1998. 1998 IEEE Asia-Pacific Conference on Circuits and Systems. Microelectronics and Integrating Systems. Proceedings (Cat. No.98EX242).