Free drop test simulation for portable IC package by implicit transient dynamics FEM

Free drop test performance of portable IC packages is a key reliability criteria for handheld products. Various experimental test methods are widely applied to measure the drop test response and to test for visual and electrical failures after the drop test. However, the experimental data we can collect is very limited, especially for the impact of stress wave propagation and distribution to the component and device. For understanding the physical transient dynamic failure problem, modeling is an effective method that provides details of the dynamic stress wave and the response at any time, any cross-section or position.