Characterization and Modeling of BTI in SiC MOSFETs

SiC power MOSFETs have been investigated by performing two different kinds of measurements, the hysteresis between two adjecent sweeps and the positive bias temperature instability, at different temperatures. The threshold hysteresis is a measure of the switching dynamics of the interface traps, while measurements at long stress times can reveal the role of an additional interface degradation. In order to fully understand the role played by the latter mechanisms, TCAD simulations have been calibrated in order to reproduce the experimental results.

[1]  Aivars J. Lelis,et al.  Basic Mechanisms of Threshold-Voltage Instability and Implications for Reliability Testing of SiC MOSFETs , 2015, IEEE Transactions on Electron Devices.

[2]  A. Tallarico,et al.  Negative Bias Temperature Stress Reliability in Trench-Gated P-Channel Power MOSFETs , 2014, IEEE Transactions on Device and Materials Reliability.

[3]  T. Grasser,et al.  A Model for Switching Traps in Amorphous Oxides , 2009, 2009 International Conference on Simulation of Semiconductor Processes and Devices.

[4]  Masayuki Imaizumi,et al.  Realization of Low On-Resistance 4H-SiC Power MOSFETs by Using Retrograde Profile in P-Body , 2007 .

[5]  G. G. Stokes "J." , 1890, The New Yale Book of Quotations.

[6]  X. Xu,et al.  TCAD modeling for reliability , 2018, Microelectron. Reliab..

[7]  Karl Hess,et al.  MOSFET degradation kinetics and its simulation , 2003 .

[8]  T. Grasser,et al.  Dispersive Transport and Negative Bias Temperature Instability: Boundary Conditions, Initial Conditions, and Transport Models , 2008, IEEE Transactions on Device and Materials Reliability.

[9]  Muhammad Ashraful Alam,et al.  A comprehensive model of PMOS NBTI degradation , 2005, Microelectron. Reliab..

[10]  Tibor Grasser,et al.  Understanding BTI in SiC MOSFETs and Its Impact on Circuit Operation , 2018, IEEE Transactions on Device and Materials Reliability.

[11]  Giuseppe Greco,et al.  Electrical characterization of trapping phenomena at SiO2/SiC and SiO2/GaN in MOS‐based devices , 2017 .