TAB film tape for a semiconductor package

TAB film tape for a semiconductor package, with - A base film (60) having a chip mounting surface (51) for attaching at least one semiconductor chip and - A wiring structure (70) formed on the base film and a plurality of output terminal structures (74) extending from the chip mounting surface, and a plurality of Ausgangsprufkontaktstellen (78), wherein each one Ausgangsprufkontaktstelle is connected to an output terminal structure, characterized in that - Each semiconductor chip has more than one, juxtaposed in a row direction groups of Ausgangsprufkontaktstellen (78), said Ausgangsprufkontaktstellen are arranged in a plurality of rows in each group (78a-78b), and each group contains two Ausgangsprufkontaktstellen least in at least one line.