Application of thermoelectric cooling to electronic equipment: a review and analysis
暂无分享,去创建一个
[1] Richard Ewell,et al. New materials and devices for thermoelectric applications , 1997, IECEC-97 Proceedings of the Thirty-Second Intersociety Energy Conversion Engineering Conference (Cat. No.97CH6203).
[2] Yuan Taur,et al. CMOS devices below 0.1 /spl mu/m: how high will performance go? , 1997, International Electron Devices Meeting. IEDM Technical Digest.
[3] J. Fleurial,et al. Thermal management of power electronics using thermoelectric coolers , 1996, Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96.
[4] George S. Nolas,et al. The next generation of thermoelectric materials , 1998, Seventeenth International Conference on Thermoelectrics. Proceedings ICT98 (Cat. No.98TH8365).
[5] J. G. Stockholm,et al. Current state of Peltier cooling , 1997, XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291).
[6] S. Cronin,et al. Low dimensional thermoelectrics , 1997, XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291).
[7] D. Morelli,et al. Potential applications of advanced thermoelectrics in the automobile industry , 1996, Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96.
[8] H. B. Lyon,et al. Thermoelectric cooler utility for electronic applications , 1996 .
[9] R. C. Chu,et al. Cooling Technology for High Performance Computers: Design Applications , 1994 .