Method for detecting surface defects of chip cut from wafer surface

The invention relates to a method for detecting surface defects for a chip cut from a wafer surface, which comprises the steps of: 1, creating a wafer surface template image library of a defect-free wafer surface; 2, acquiring an image of a single chip to be detected; 3, comparing the image of the single chip to be detected with images in the wafer surface template image library and judging whether the chip cut from a wafer surface has surface defects or not according to the comparison result. The method can accurately identify defects of broken edges, scratches, pollution and the like, and is characterized by rapidness and accuracy. The method has simple processing method and can be used as an independent module to be integrated in a system conveniently, and reduces the test cost of chips and stabilizing the yield of chips.