Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

[1]  G. Li,et al.  Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process , 2004 .

[2]  X. Shi,et al.  Effects of Sb addition on tensile strength of Sn-3.5Ag-0.7Cu solder alloy and joint , 2006 .

[3]  Honghai Zhang,et al.  Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5 , 2007 .

[4]  Mike Roellig,et al.  The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[5]  Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy , 2009 .

[6]  Li-Wei Lin,et al.  Alloying modification of Sn-Ag-Cu solders by manganese and titanium , 2009, Microelectron. Reliab..

[7]  A. E. Hammad,et al.  Creep properties of Sn–Sb based lead-free solder alloys , 2009 .

[8]  T. Ariga,et al.  Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy , 2009 .

[9]  S. Xue,et al.  Review Article: Effect of alloying elements on properties and microstructures of SnAgCu solders , 2010 .

[10]  Yinlu Gao,et al.  Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition , 2010 .

[11]  X. R. Zhang,et al.  The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures , 2010 .

[12]  Chao-hong Wang,et al.  Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate , 2010 .

[13]  Tomi Laurila,et al.  Impurity and alloying effects on interfacial reaction layers in Pb-free soldering , 2010 .

[14]  T. Ariga,et al.  Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders , 2010 .

[15]  M. Rappaz,et al.  Effects of solidification kinetics on microstructure formation in binary Sn-Cu solder alloys , 2011 .

[16]  R. Mahmudi,et al.  Effect of Sb addition on the tensile deformation behavior of lead-free Sn–3.5Ag solder alloy , 2011 .

[17]  Y. C. Chan,et al.  Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates , 2011, Microelectron. Reliab..

[18]  K. Kanlayasiri,et al.  Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate , 2011 .

[19]  A. El-Daly,et al.  Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu , 2011 .

[20]  R. Mahmudi,et al.  Microstructure and tensile behavior of Sn–5Sb lead-free solder alloy containing Bi and Cu , 2011 .

[21]  Y.-L. Shen,et al.  Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys , 2011, Microelectron. Reliab..

[22]  Wurong Wang,et al.  Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging , 2011 .

[23]  Sung K. Kang,et al.  Effects of Ti addition to Sn–Ag and Sn–Cu solders , 2012 .

[24]  Jing Zhang,et al.  Effect of initial microstructure on the hot compression deformation behavior of a 2219 aluminum alloy , 2012 .

[25]  R. Mahmudi,et al.  Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag , 2012 .

[26]  A. E. Hammad,et al.  Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions , 2012 .