Design and demonstration of low cost, panel-based polycrystalline silicon interposer with through-package-vias (TPVs)
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Rao Tummala | Fuhan Liu | Madhavan Swaminathan | Venky Sundaram | Tapobrata Bandyopadhyay | Yuya Suzuki | V. Sundaram | Fuhan Liu | R. Tummala | M. Swaminathan | Yuya Suzuki | Qiao Chen | R. Pucha | T. Bandyopadhyay | Qiao Chen | Raghuram Pucha
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