In Situ Study of the Electrochemical Migration of Tin under Bipolar Square Wave Voltage

[1]  X. Zhong,et al.  Test methods for electrochemical migration: a review , 2016, Journal of Materials Science: Materials in Electronics.

[2]  R. Ambat,et al.  Effect of pulsed voltage on electrochemical migration of tin in electronics , 2015, Journal of Materials Science: Materials in Electronics.

[3]  B. Medgyes,et al.  Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics , 2015 .

[4]  B. Ramezanzadeh,et al.  Evaluation of the Anticorrosion and Adhesion Properties of an Epoxy/Polyamide Coating Applied on the Steel Surface Treated by an Ambient Temperature Zinc Phosphate Coating Containing Ni2+ Cations , 2015 .

[5]  M. Pecht,et al.  Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation , 2014 .

[6]  Seung-Boo Jung,et al.  Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions , 2014, Microelectron. Reliab..

[7]  C. Dong,et al.  Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment , 2013 .

[8]  M. Jellesen,et al.  Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components , 2013 .

[9]  Guoan Zhang,et al.  Electrochemical migration of tin in thin electrolyte layer containing chloride ions , 2013 .

[10]  Guoan Zhang,et al.  In situ study the dependence of electrochemical migration of tin on chloride , 2013 .

[11]  B. Medgyes,et al.  Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates , 2013, Journal of Materials Science: Materials in Electronics.

[12]  Guoan Zhang,et al.  In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field , 2013 .

[13]  C. Fu,et al.  The corrosion of tin under thin electrolyte layers containing chloride , 2013 .

[14]  B. Medgyes,et al.  Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37 , 2012, Journal of Materials Science: Materials in Electronics.

[15]  Rajan Ambat,et al.  On the electrochemical migration mechanism of tin in electronics , 2011 .

[16]  Young‐Chang Joo,et al.  Effect of the composition of Sn-Pb alloys on the microstructure of filaments and the electrochemical migration characteristics , 2011 .

[17]  Michael Pecht,et al.  Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder , 2011 .

[18]  Rajan Ambat,et al.  Electrochemical migration of tin in electronics and microstructure of the dendrites , 2011 .

[19]  Rajan Ambat,et al.  Corrosion failure due to flux residues in an electronic add-on device , 2010 .

[20]  Young-Chang Joo,et al.  Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb , 2009, IEEE Transactions on Device and Materials Reliability.

[21]  Young‐Chang Joo,et al.  Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions , 2009 .

[22]  Young‐Chang Joo,et al.  Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions , 2008 .

[23]  Young‐Chang Joo,et al.  Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions , 2008 .

[24]  Sheng Zhan,et al.  Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[25]  W. Jillek,et al.  Electrochemical migration of lead free solder joints , 2006 .

[26]  D. Q. Yu,et al.  Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water , 2006 .

[27]  M. Potin-Gautier,et al.  A critical review of thermodynamic data for inorganic tin species , 2001 .

[28]  M. Rosso,et al.  Viscosity Effects in Thin-Layer Electrodeposition , 2001 .

[29]  K. Zhang,et al.  Nanostructured copper filaments in electrochemical deposition. , 2001, Physical review letters.

[30]  H. Swinney,et al.  Buoyancy and electrically driven convection models in thin-layer electrodeposition , 1999 .

[31]  Atsushi Nishikata,et al.  An application of electrochemical impedance spectroscopy to atmospheric corrosion study , 1995 .

[32]  D. Barkey Morphology Selection and the Concentration Boundary Layer in Electrochemical Deposition , 1991 .

[33]  L. C. Hall,et al.  A Review of Corrosion Failure Mechanisms during Accelerated Tests Electrolytic Metal Migration , 1987 .