论文信息 - Novel technology for hybrid integration of photonic and electronic circuits

Novel technology for hybrid integration of photonic and electronic circuits

We have developed a new three-dimensional integration technology which involves hybrid integration of photonic and electronic circuits by means of polyimide bonding. To demonstrate this technology, we fabricated a GaAs metal-semiconductor-metal photodetector on a silicon substrate. Each photodetector on a polyimide layer is electrically connected to the electrode on the silicon substrate. The electrical interconnection between the photodetector and electrode on the silicon substrate consists of electroplated gold through a through-hole. The photoresponsivity of the photodetector is 0.3 A/W.

T. Kurokawa | T. Nakahara | S. Matsuo | K. Tateno

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