An L-band power amplifier multi-chip-module using multi-layered planar circuits

A power amplifier Multi-Chip-Module (MCM) was developed for an L-band digital cordless telephone. To realize both the high power added efficiency and small outline, MMIC design in the MCM is combined with design of a multi-layered planar circuit. The maximum gain of 37.1 dB and output power of 25.6 dBm are obtained at 1.9 GHz. Maximum total power added efficiency is 25% at 2.0 GHz. A power added efficiency of a final stage power FET is estimated at 36%. An outline of 8.0/spl times/6.2/spl times/1.9 mm/sup 3/ is comparable with MMICs.<<ETX>>